Dr. Chiwon HWANG

Chiwon Hwang is a head of Semiconductor Package Substrate R&D at Samsung Electro-Mechanics, South Korea. His current R&D interests include device embedding in Substrates and novel core structures for PI/SI solutions.

He received the Ph.D. degrees in Materials Science and Engineering from Osaka University, Japan in 2004 and worked at Intel Corporation as a researcher from 2004~2011 to demonstrate new package design for high performance computing CPU.   

Presentation Title:
Substrates Technology and Trend for High Performance Semiconductor Packages

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Co-organized by the HKPCA & KPCA