Dr. Gary WIDDOWSON

Dr. Gary Widdowson is a Senior Vice President and Chief Technology Officer of the Group’s Semiconductor Solutions Segment.

With more than 30 years of experience across various engineering and research & development (R&D) roles with the Segment, Gary has a wealth of technology expertise and a proven ability to drive innovation and lead teams effectively. Gary’s focus is on demonstrating clear innovation and technology leadership across the Segment’s advanced packaging (AP), mainstream and software solutions. He was previously one of the key leaders for the Segment’s AP R&D team.

Gary holds a Bachelor of Engineering degree and a Doctor of Philosophy degree, both in Electrical Engineering from the University of Sheffield, United Kingdom.
 

Presentation Title

Pioneering Advanced Packaging Solutions for Heterogeneous Integration in Chiplet Ecosystems and Silicon Photonics

Abstract

Dr. Gary Widdowson, CTO of ASMPT Semiconductor Solutions, presents a comprehensive roadmap for addressing advanced packaging challenges in heterogeneous integration and silicon photonics. The presentation highlights ASMPT’s leadership in enabling chiplet-based architectures through innovations like Panel ECD for large-format substrates (510mm x 515mm), ultra-short-pulse laser wafer separation for zero-burr singulation, and AORTM Fluxless Thermo Compression Bonding for high-density logic and HBM integration. It addresses critical industry challenges, such as warpage mitigation via glass-core substrates, productivity gains through panel-level packaging, and bandwidth demands via Co-Packaged Optics (CPO) solutions achieving ±0.5µm alignment. The presentation explores 3.5D integration advancements, hybrid bonding with sub-100nm precision, and AI-driven process optimization for defect detection and yield improvement. By emphasizing collaborative ecosystem partnerships and sustainable packaging systems, ASMPT Semiconductor Solutions positions itself as the strategic enabler of next-generation AI, HPC, and photonics applications, delivering end-to-end solutions from plating to bonding.

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