Dr. Kelvin PUN - Keynote Speaker

Dr. Kelvin Pun is currently the Vice President of Goertek Microelectronics. With over twenty years of experience in semiconductor packaging industry, he has led several projects related to innovation strategies and R&D implementation, including the Innovation and Technology Fund project from the Hong Kong SAR government. He serves as an industrial advisor and committee member at City University of Hong Kong. He is also currently serving as Guest Professor at Guangdong University of Technology.

As an expert in packaging technology, he is dedicated to researching and industrializing advanced substrates, packaging technologies, sensors, digital healthcare, optoelectronics, and related microsystems.

He has published over 20 papers and holds 30 international patents. Dr. Pun is a chartered engineer, senior member of IEEE, and member of Semiconductor Nanotechnology Alliance (SNA). He has served as a technical committee member and session chair at ICEPT. He delivered keynote speeches on advanced packaging materials at ECTC. The projects he has led and participated in have received prestigious recognition, including the R&D100, Inventions of Geneva, and Best Paper Award at IEEE conferences.

Presentation Title:
Keynote: Latest Advancement in Glass Substrate Technology for Advanced Packaging

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Co-organized by the HKPCA & KPCA