Mr. Eyal SEGEV

Mr. Eyal Segev serves as Marketing Director in Camtek Ltd, with 20 years of experience in the Semiconductor industry, managing products in a multi-disciplinary environment. 

He has registered several patents in the field of optical metrology, striving to solve challenges in the dynamic production environment and enhance metrology capabilities and accuracy. 

He holds a B.Sc in Mechanical Engineering and a Master's in Business Administration (MBA).

Presentation Title

Evolution of Inspection and Metrology in the AI Era

Abstract

With the fast growth in the Advanced Packaging market and the shift into 3D packaging, Heterogenous Integration, Hybrid bonding and other trends, new challenges arise for the inspection and metrology of bumps, ensuring known-good-die and known-good package. The decreased size of bumps and increased density form complex architectures (such as Chiplet, SoC, 3DIC) that challenge metrology capabilities and require innovative solutions to ensure the reliability of the package. Camtek, as an experienced inspection and metrology equipment manufacturer, develops new inspection and metrology methods to address these many challenges in the various process steps, including: Dicing, Bumping, Reconstructing, RDL layers, Die Stacking, Fan-out, etc. The solutions are multi-disciplinary and combine optics, algorithmics, physics, handling, data processing, defect classification and analytics. In this presentation I will present some of our solutions for Heterogenous Integration.

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