Mr. Hidenori ABE
CTO for Semiconductor Materials, Resonac Holdings Corporation, Executive Director, Electronics Business Headquarters, Resonac Corporation
Hidenori Abe is CTO for semiconductor materials at Resonac Holdings Corporation and Executive director of Electronics Business Headquarters at Resonac Corporation. He leads electronics materials R&D and strategy for semiconductors, substrates and displays. He was previously head of the Electronics R&D Center and Packaging Solution Center, which is an open innovation hub in advanced packaging development. In that role, he directed the launch of JOINT2 in 2021, an advanced packaging consortium targeting 2.xD and 3D packages.
He served as General Manager of CMP Slurry Business Sector for three years and, before that, was Manager of the Marketing Promotion Group in the Innovation Promotion Center. In his role with the Marketing Promotion Group, he promoted new R&D projects, especially those targeting new market segments using new technologies. He also served as Manager of the Business Development Group in the Packaging Solution Center where he had responsibility for promoting the company’s open laboratory to partners such as customers and equipment makers, and for marketing wearable-related materials.
He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.
Presentation Title
Advanced Packaging Materials Innovation through Co-Creative Activities
Abstract
In the field of semiconductors that support the evolution of generative AI, attention is being focused on innovative packaging technology. Resonac, a co-creation chemical company, has launched the evaluation platform "JOINT2" with domestic and international material, substrate, and equipment manufacturers to accelerate the development of cutting-edge packaging technology and promote technological development.
In this presentation, we will explain the trends in advanced packaging materials and the latest technology in panel interposer-related materials. We will also introduce the value brought by co-creation, material innovation through co-creation activities, and global strategies.
Back to Advanced Packaging & Heterogeneous Integration Summit