Mr. Ingu Yin CHANG - Keynote Speaker

Ingu Yin Chang is the Executive Vice President at ASE Inc., based in Sunnyvale, California. In his current role, he is responsible for developing and executing sales strategy, while driving global initiatives for ASE’s expanding packaging, systems, and integration solutions portfolio.

Prior to joining ASE in 2013, Yin was CEO of Vertical Circuits Inc. (VCI), a company focused on the development of next generation vertical interconnect for next generation silicon integration. Previously, Yin performed a variety of management roles covering sales and operations at Amkor with responsibility for the Greater China region. He has over thirty years of leadership experience in executive management, sales, business development, IP management and strategic alliance.

Yin received his material science engineering degree from University of California, Berkeley.

Presentation Title
Propelling AI forward through Advanced Packaging Creativity

Abstract
The semiconductor industry is stacked with groundbreaking innovation that is helping to weave intelligence into every dimension of life, through generative, agentic and physical AI models, spanning all the way from the cloud to the edge. Heterogeneous Integration through advanced packaging is playing a pivotal role in pushing physical, electrical, and thermal limits to achieve better energy efficiency and greater compute power. During his keynote, ASE’s Yin Chang will set the stage by exploring the AI landscape, highlighting challenges that require our collective attention, particularly as we move from electrons to photons. He will then expand on how advanced packaging creativity is propelling AI forward by integrating higher-performance chips within smaller form factors for transformative latency improvement and bandwidth enhancement.
 

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