Mr. Jan Sing LOH

Jan Sing currently serves as a Vice President of Backend Package Development located in Infineon Singapore and additionally holding a responsibility as Chief R&D Officer for Infineon Indonesia. With over 26 years of experience in semiconductor industry, he has had the privilege of leading package technology development and innovation in Power Technology, High Voltage Isolation and Discrete IC.

Prior to his leadership roles in R&D, he had broad experiences in semiconductor manufacturing environment specifically in Power Package Assembly and Test Manufacturing.

His leadership philosophy centers around empowering team, collaboration and challenging boundary to enable forefront technology for more value creations to business and society.

Presentation Title

WBG Technology Shaping Future Packaging Innovation

Abstract

WBG SiC and GaN are at the forefront of the next wave of high voltage application especially in automotive and renewable energy innovations, primarily due to their fundamental properties that offering higher efficiency, faster switching speeds, and higher operating temperatures than traditional silicon devices. However, their advantages come with significant packaging challenges, especially in thermal management, electrical performance, and reliability. In order to unleash full potential of them, innovative packaging concept, advanced packaging material and processes are the key enablers. Furthermore, adding higher value proposition by extending into System-In-Package with integrated power switches and IC like driver, controller and sensor has increased the power packaging challenges on top of standard Power Discrete Packaging Solution. Hence further innovation and development efforts are very much needed to fulfill the market needs especially for automotive, renewable energy and AI server.

The presentation will cover topics on:

1. Mega trend of High-Power Application in Market.
2. Latest power application requirements driving on discrete and SiP of power packages
3. Challenges and its opportunities eg. (but not limited to)

        - Thermal performance especially in SiP Power

        - Advanced Material requirement eg. EMC

        - Interconnects eg. Reducing stray inductance for GaN

        - Way forward for power packaging

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