Mr. John WEST

John West is Chief Analyst, Semiconductor Equipment at Yole Group.

He has over 20 years of industry experience and a successful track record in various strategy and consulting projects.

John has a Bachelor's Degree in Medical Physics from King's College London and an MBA from Cranfield School of Management.

Presentation Title

Advanced Packaging Market, Technology, and Manufacturing Trends

Abstract

High-end performance packaging technologies are evolving rapidly to deliver the bandwidth density and power efficiency required by the next generation of chip designs. The industry's success or failure to provide manufacturing solutions will be a key limiting factor in the rollout of these new chip designs. This presentation reviews the current high-end performance packaging technologies and explores challenges from a manufacturing and test perspective.

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