Mr. Steve JIN

25 years of experience in advanced packaging industry. familiar with WLP, SiP and optical module. Pioneer of Cu pillar bump and FOWLP technology in Singapore.

There are 8 years working experience in Apple Singapore, and 7 years of experience in STMicroelectronics.

Presentation Title

3rd Generation Panel Level FOPLP for Integrated Optical Module and High-Power Package

Abstract

The 3rd Generation Fan-Out Panel Level Packaging (FOPLP) for AI integrated optical modules and high-power packages represent a significant advancement in packaging technology. It addresses the need for higher density and compact designs, enabling effective miniaturization without sacrificing performance. Key features include enhanced thermal management for reliable high-power operation and cost-effective manufacturing through scalable panel-level designs. Improved signal integrity enhances performance in high-speed data communication, telecommunications, and sensor applications. As industry trends focus on automation and advanced materials, FOPLP is poised to shape optical device design, meeting increasing demands for data capacity and speed in modern networks. This paper examines the essential features, applications, and future prospects of this innovative packaging technology.

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