Mr. Terrance LEE

Terrance has over 30 years of experience in the Semiconductor field. He is currently the head of the Dielectric CVD Product Management and Strategy group with responsibilities in defining the strategic roadmaps and marketing of Applied's dielectric CVD products. He is also responsible for wafer fabrication equipment market analysis and increasing revenue generation by strategically aligning business products to customer requirements and technology inflections. Previously, he held strategy and marketing responsibilities for the Chemical Mechanical Planarization and Plating Business Units. He has worked in both technology and business development, growing the DDP business organically and inorganically (mergers and acquisitions, and Applied Ventures). Before joining Applied Materials, he held executive positions in business development and finance in the capital equipment sector. He began his career as a process engineer. He earned a B.S. in chemical engineering from the University of California, Berkeley, and holds 13 patents in Etch, CVD, and CMP.

Presentation Title
From Complexity to Capability: Enabling Breakthroughs in Critical Advanced Packaging Technologies

Abstract

Advanced packaging technologies are now essential to enabling the next generation of AI and high-performance computing applications. At the same time, the manufacturing processes of these packages have become far more complex, creating new requirements for integration flows and cycle times. As a result, the traditional boundaries between front-end and back-end manufacturing are blurring.

Meeting the demands of this era will require the development of new materials, novel processes, and more connected solutions. Furthermore, successfully delivering these innovations will necessitate a unique model of collaboration that unifies academia, industry, and government for high-velocity innovation and commercialization.

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