Mr. Youngseob SHIN
Advanced Substrate Technology Development Engineer, HPC FCBGA Warpage solution TF leader, Amkor Technology
Electro Communication Engineering, Hanyang University
RFPCB Product Development Engineer, YP Electronics
Battery Management Unit Project Manager, ITM Semiconductor (Vietnam)
Advanced Substrate Technology Development Engineer, HPC FCBGA Warpage solution TF leader, Amkor R&D
Presentation Title:
AI / HPC Advanced Substrate Technology Overview
Back to The Future of IC Substrates and Beyond Symposium
Co-organized by the HKPCA & KPCA