Dr. Jie WU
Head of Technical Customer Service, South East Asia, Henkel - Electronics, Singapore
Wu Jie, Ph.D. MEMS NTU, has 12 years of experience in technical and development for the semiconductor packaging assembly industry. In his current role as the Henkel AEE Regional Head of TCS, South East Asia, he has a strong focus to drive and support solutions for packaging miniaturization needs, to achieve higher performances of powered electronics and high-frequency electronics such as 5G across the region.
Presentation Title:
Semi-Sintering Die Attach Paste for Power and High-Frequency Electronics
To achieve higher performance of power electronics and high-frequency electronics (for 5G), packaging and interconnect are driven towards miniaturization as well as expanded functionality. The mature thermal interface materials mainly focus board and component level. At the die level, more user-friendly and effective thermal management solutions are needed. With overcoming the regulatory challenges of solder, thermal conductivity limitations of traditional die attach materials, and processability complexities of pure sintering pastes, semi-sintering die attach paste has simplified processing, and high thermal conductivity with robust reliability. In this presentation, technology of semi-sintering will be first introduced. Application study and reliability performance based on a challenging scenario with the latest semi-sintering paste will also be discussed.