Mr. Chee Ping LEE

Lee Chee Ping is the Technical Director from Lam Research, focusing on the heterogeneous integration  segment. He has more than 18 years of experience in semiconductor industry, of which 12 years are related to advanced packaging. He has led worldwide field process teams and worked closely with customers on various 2D/2.5D/3D technologies development and qualification. He also engages the microelectronics supply chain from fabless players, IDMs, OSATs to equipment & material suppliers on technical exchanges and collaborations. In view of his deep understanding of this segment, he now oversees advanced packaging market analysis and technology trends mapping, along with technical marketing of Lam’s wafer level equipment solutions. He has presented at multiple advanced semiconductor packaging conferences.

Lee Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.

Presentation Title:
Innovative Equipment Solutions in new era of Heterogeneous Integration

Increasing the escalating cost of front end manufacturing associated with leading edge silicon technology has driven renewed focus on alternative approaches beyond traditional node scaling and system on chip. One of the leading techniques actively pursued in industry today is chiplets heterogenous integration (HI). HI brings multiple chips (or chiplets) together into a single package. It is said to enable Moore’s Law extension, as well as enabling More than Moore.

Latest generation of heterogenous integration elevates a conceptually similar multi-chip modules to the next level by leveraging advanced wafer manufacturing technologies. This presentation will share market and technology insights into this new frontier. It will follow with overview of innovative wafer-level equipment solutions by Lam that enable the technology underpinning heterogeneous integration. 

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