Dr. Jie WU
Senior Manager Application Engineering Henkel, Singapore
Ph.D. in micro-electromechanical system (MEMS). Over 12 years of experience in development and customer support of semiconductor/electronic packaging and assembly. Over the years, Dr Jie Wu have worked on cross-functional solution development in various fields such as die pick & place, advanced packaging, and wire boning, etc.. Currently, he is leading a diverse Application Engineering team in SEA to serve electronic accounts. He is also managing Labs in Singapore and Vietnam to support customer failure analysis as well as product development activities.
Presentation Title:
Material Solutions to the Challenges in Heterogeneous Integration
Driven by cost, performance and functional density, packaging technology has become more important in the development for markets including wireless, IoT, automotive, power management and computer networking. Comparing to the system on chip (SoC), heterogeneous integration (HI) with advanced packaging technologies is a more attractive integration solution with considering of factors such as yield, performance, cost optimization, as well as time-to-market. With increasing of the integration complexity, more challenges in heat dissipation, miniaturization and reliability need to be overcome. This presentation reviews key challenges of heterogeneous integration and introduces how Henkel premier materials to enable advanced packaging technologies adopted in heterogeneous integration, such as fine pitch flip-chip, wafer-level packaging (WLP), thermocompression bonding (TCB) and through-silicon vias (TSVs). Detailed discussion of application study and reliability performance with Henkel latest pressure-less sintering technology is also included.