Dr. Suresh Kumar SINGARAM
Head of ATTF Evatec SEA, Singapore
Dr Suresh Kumar Singaram has been in the semiconductor equipment business for 20 years holding various roles in engineering, product management, global technical support and operations. Dr Kumar currently heads a regional team in Evatec SEA which provides software support, advanced process development as well new platform/technology transfer from Evatec HQ into the region. Dr Kumar’s current interests include the use of AI and machine learning for advanced analytics in process control as well as diagnostics. Dr Kumar holds a PhD in Plasma Physics from Nanyang Technological University Singapore.
Presentation Title:
PVD Applications to Enable Heterogenous Integration
Industry Leading Contact Resistance, BSM for Heat Dissipation, Thin Wafer Handling, IDM qualified Contamination Protection.
Advanced packaging has become a vital part of a device makers competitive advantage in the market. As IDM’s and fabless companies continue to develop new packaging designs, they are often running into unforeseen challenges in the back-end. PVD is a critical enabling technology for many integration schemes, and equipment suppliers like Evatec are responding to the challenges. Device designers can take advantage of this experience as they must find solutions for issues such as Resistance Budget from FET to Pad, Heat Dissipation of Thermal Loads and Cross Talk, Thin Die Roadmaps as well as Multi Die Packaging or Chiplet integration. This presentation is an overview of latest technologies enhancements to meet roadmap requirements