Mr. Duen Kai CHANG
Senior Technical Service and Development Specialist Dow Chemical Pacific, Singapore
Duen Kai Chang is Senior Technical Service and Development Specialist in Dow focusing on Consumer Electronics providing technical service for Microelectronics, MEMS and Sensors applications. He has total working experience over 11 years. His past work experience includes product design and failure analysis of pyroelectric sensor with focus on PCB and packaging design for EMI improvement. He also has several years of experience in Epoxy Molding Compound product formulation design and technical service for various package encapsulation solutions for SMD, discrete power device, BGA, memory NAND, LPDDR and etc. He is Bachelor of Industrial Technology from University Science of Malaysia.
Presentation Title:
Novel Silicone Hotmelt Solutions for Microelectronics
An optically clear silicone hotmelt film (SHF), Silicone hotmelt cartridge (SHC) for large area encapsulation and soft molding, high thermally stable (up to 250°C) silicone hotmelt tablet (SHT) for transfer molding will be presented. These novel silicone hotmelt solutions provide excellent stress relaxation capability, enabling stress-free large-area encapsulation due to high planarity to mitigate warpage issue. In addition, it offers excellent adhesion strength to a variety of substrates. The novel technologies described in this presentation will break some of these barriers and utilize silicone in microelectronics applications where it has never been used before.