Glen SIEW
Director, R&D Strategic Roadmapping Amkor Technology, Singapore
Glen Siew leads Amkor on strategic R&D activities , focusing on package and process R&D roadmap and its relevant partnership with industry alliance and other commercial organizations. Prior to Amkor, Glen served in management roles managing cross functional initiatives within design and process technology with ams Sensors, Nepes and Altera. His experience spans various technology solutions focusing on future packaging R&D technology through extensive R&D and study in innovative and breakthrough in packaging technology
Presentation Title:
Empowering Front-End Cellular Innovations with Advanced SiP Solutions
The advanced SiP double sided molded BGA and 5G antenna module have established an industry technology standard in this packaging domain. Applying leading-edge design rules for 3D component placement and double-sided molding, together with conformal and compartmental shielding and in-line RF testing, delivers best-in-class integration levels in a small form factor with high yield. To create such innovative structures, the industry developed an extensive toolset to maximize performance and to address the sophisticated packaging formats required to productize 5G applications. These tools include advanced design rules, molded underfill, physical vapor deposition and a variety of RF shielding design options.