Mr. Hem TAKIAR
Corporate Vice President, Packaging Development & Engineering Micron Technology, Inc, United States
Over 40 years of extensive experience in semiconductor packaging from design to high volume manufacturing, product development, manufacturing operations, strategic planning. Experienced in managing global teams, Product Life cycle, Six Sigma, transformational initiatives and Strategic Partnerships, demonstrated success in semiconductor/product packaging and Quality operations.
His experience includes leadership positions at Western Digital, SanDisk, Novalux and National Semiconductor Instrumental at driving several industry initiatives under SEMI Masters in Material Science from University of Illinois at Urbana-Champaign (US)
Bachelor in Metallurgical Engineering from Indian Institute of Technology Kanpur (India).
Presentation Title:
Leading Methodologies Provide the Foundational Building Blocks Across the Industry for the Continued Growth and Expansion Over the Next Decade
The semiconductor market for memories (DRAM and NAND) continues its exponential growth across all segments. This trend provides new opportunities as well as several challenges for Advanced Packaging to meet aggressive requirements on performance, cost and miniaturization.
This work first outlines critical challenges across a broad range of packaging architectures: a) Advanced Wirebonding and System-in-Package (SiP), b) Flip-Chip and ASIC controllers, c) HBM (high bandwidth memories with TSVs). Key barriers including package scaling to address package tolerances < 70um and wafer thickness < 1 um, particle management roadmap upto 0um are discussed.
Advanced techniques and tools available or needed to mitigate these challenges are summarized; Recent innovations in Process Digital Twins (using transient modeling) for faster time to market, Advanced Process controls for variability reduction and defect elimination and Advanced EDA/ Co-Design tools for system level optimizations. These methodologies provide the foundational building blocks across the industry for the continued growth and expansion over the next decade.