Meet-The-Expert @ TECHStage South
Day 1 | Tuesday, 5 May 2026 | 13:00 - 16:35
Day 2 | Wednesday, 6 May 2026 | 10:20 - 16:15
Day 3 | Thursday, 7 May 2026 | 10:20 - 14:35
TECHStage South @ Hall 8, Level 2, MITEC
The TECHStage is a free-for-all and accessed-by-all arena where exhibitors are welcome to present their showcase!
In 15 minutes, each party of presenter(s) will be given the spotlight to showcase their patented innovations and pitch their solutions. Attendees will get the chance to see the swankiest technologies and hear from some of the brightest minds from the industry.
More Information will be available soon. Stay Tuned!
Day 1 | Tuesday, 5 May 2026
| Time | Topic |
|---|---|
| 13:00 - 13:15 hrs | Introducing HDx32U: Advancing Microcontroller Innovation with Vietnamese Fabless Design Mr. David THANH | CTO | Hyphen Deux |
| 13:20 - 13:35 hrs | Autofocus Imaging System for Semiconductor Advanced Packaging Mr. Jack Eng CHIN | CEO | Soda Vision Pte Ltd |
| 13:40 - 13:55 hrs | Coating Innovations to Overcome Wear, ESD & Contamination in Semiconductor Packaging Mr. Jacob LIM | Scientist | Nanofilm Technologies International Limited |
| 14:00 - 14:15 hrs | The Shift in Industrial Quality: How AI Agents Balance Quality and Efficiency Mr. Jinsong XU | Founder & CEO | Innowave Tech |
| 14:20 - 14:35 hrs | Advanced Packaging Solution for Future Mr. Tze Lung CHONG | Senior Specialist, Application TEBG Global Application Eng | 3M Malaysia Sdn Bhd |
| 14:40 - 14:55 hrs | Malema Flow Solutions Mr. Darshan V BALAKRISHNAN | Senior Regional Sales Manager | PSG Dover |
| 15:00 - 15:15 hrs | Test Methods and Reliability Solutions of SiC Power Devices Dr. Wei LIU | Equipment Division CTO | Hangzhou Firstack Technology Co., Ltd. |
| 15:20 - 15:35 hrs | Aligning Utility Performance with Business Outcomes in Semiconductor Operations Mr. Daowei LIN | Head of Northern Region, Malaysia | ENGIE |
| 15:40 - 15:55 hrs | Chip to Wafer Bonder at 40k UPH Mr. Boud VAN BLOKLAND | Product Director Diebond | ITEC BV |
| 16:00 - 16:15 hrs | How AI Forges the Future of Manufacturing Mr. MK KOH | CTO | Gtrontec Technology Sdn. Bhd. |
| 16:20 - 16:35 hrs | PBA 's New Gantry and Metrology Solution for Semiconductor Advance Packaging Mr. Asiri INDRAJITH | Product Specialist | PBA Systems Pte. Ltd |
Day 2 | Wednesday, 6 May 2026
| Time | Topic |
|---|---|
| 10:20 - 10:35 hrs | Integrated Advanced Packaging Solutions for Southeast Asia Mr. Asics HUANG | Executive Director | Zi Lian Malaysia Sdn. Bhd. |
| 10:40 - 10:55 hrs | Advancing Die Attach Materials for High‑Performance Semiconductor Packages Mr. Jocelyn LEONG | Engineer | TANAKA Kikinzoku (Singapore) Pte Ltd |
| 11:00 - 11:15 hrs | Factors for Cobot Selection in AMR Applications in Semicon Process Mr. Vincent HOY | Key Account Manager - Factory Automation | APulsar Technologies Sdn Bhd |
| 11:20 - 11:35 hrs | Lights-Out KGD: Fully Automated Die Sorting with AI driven 6-Side Metrology Mr. Christan STOHR | Vice President Semiconductor Backend | MB Automation (Malaysia) Sdn Bhd |
| 11:40 - 11:55 hrs | Holistic Capacity Planning for Semiconductor Fabs: Combining Production and Material Handling Simulations MS. Youngju KWON | Head of Business Development & Strategic Alliances | VMS Solutions |
| 13:20 - 13:35 hrs | Advanced Lithography Technologies for Packaging: Enabling Next‑Gen Plasma Dicing Applications Mr. Tobias ZENGER | Deputy Process Technology Manager Europe | EV Group (EVG) |
| 13:40 - 13:55 hrs | Green Procurement For Sustainable Manufacturing Mdm. Rose KUAN | Executive Director | Shan Poornam Group of Companies |
| 14:00 - 14:15 hrs | Where Smart Dispensing Meets Speed and Accuracy Mr. Desmond PAN | Senior Engineer, Advanced Dispensing Solutions | Kulicke & Soffa Pte Ltd |
| 14:20 - 14:35 hrs | SemiMarket: A Global Marketplace + Value Chain Platform for Legacy Assets Mr. Jeff KIM | Sales Managing Director | SurplusGLOBAL |
| 14:40 - 14:55 hrs | Choosing the Right Contacting Strategy: Scrubbing vs Non-Scrubbing Solutions for Advanced Semiconductor Testing Ms. Grace Ann NEE YEE | Assistant Manager - Center of Excellence | JF Microtechnology Sdn. Bhd. |
| 15:00 - 15:15 hrs | PC-based control for semiconductor industry Mr. Marcel ELLWART | Semiconductor Industry Manager | Beckhoff Automation |
| 15:20 - 15:35 hrs | Next-Level Heterogeneous Integration: Advanced Dispensing for Complex Packaging Mr. Joo Seng GOEE | Business Development Manager | NSW Automation Sdn. Bhd. |
| 15:40 - 15:55 hrs | AFM Solutions for Front End & Back End Metrology Mr. Xun Hao CHOK | Technical Sales Manager | Park Systems Pte Ltd |
| 16:00 - 16:15 hrs | Spectral Vision Mr. Charles HO | Technical Sales Manager | PVA TePla Singapore Pte Ltd |
Day 3 | Thursday, 7 May 2026
| Time | Topic |
|---|---|
| 10:20 - 10:35 hrs | Laser Pattern Transfer Printing: Enabling High-Resolution, High-Volume Manufacturing for Advanced Packaging and Microelectronics Mr. Edmond SOH | Business Development Manager | DR Laser Singapore Pte Ltd |
| 10:40 - 10:55 hrs | Maximizing Test Efficiency with Reliable Instruments & Cost - Effective Solutions Mr. Wen jie SHEN | Sales Director, APAC | Mvit Technology |
| 11:00 - 11:15 hrs | Proterial, Specialist in Corrosion Resistant Alloys and High Purity Electroplated Aluminium for Critical Semiconductor Processing Equipment Components Mr. Beng Huat & Enoch, LOW & LIM | Director, Global Sales & Marketing Manager | Proterial Asia Pacific Pte Ltd |
| 11:20 - 11:35 hrs | Advanced Coating Technologies for Photonics and Optical Applications in Semiconductor Mr. Alexander KUNZ | Senior Technologist | Buhler Leybold Optics |
| 11:40 - 11:55 hrs | Warpage Control in Panel-Level Packaging Dr. Gladys HUNG | Managing Director | NDS (TAIWAN) Co., Ltd. |
| 13:20 - 13:35 hrs | Revolutionising Advanced Packaging with Vision AI Inspection Mr. Min Shen OON | Global Business Development - S.E.A. | ViTrox Technologies Sdn. Bhd. |
| 13:40 - 13:55 hrs | Inventec Coolant Introduction Mr. Steven TEH | Technical Manager | Inventec Performance Chemicals |
| 14:00 - 14:15 hrs | Reflow and Reliability of InAg Soldering Thermal Interface Materials with and without Flux for TIM1 and TIM1.5 Application Mr. Siang Hooi FOO | Assistant Product Manager | Indium Corporation |
| 14:20 - 14:35 hrs | Smarter manufacturing starts here: AI innovations in Monitor ERP Mr. Tyreal TAI | Sales Director | Monitor ERP System Sdn Bhd |