Prof. Lim Yeow Kheng

Yeow Kheng is the Assistant Dean of College of Design Engineering (CDE), a Professor in Department of Electrical and Computer Engineering (ECE) and the Programme Director of Singapore Hybrid-Integrated Next-Generation μ-Electronics (SHINE) Centre at the National University of Singapore (NUS). He has more than 20 years of experience in semiconductor foundries technology development and Outsourced Semiconductor Assembly and Test (OSAT) manufacturing and business operations. 
He started his career at Chartered Semiconductor Manufacturing (currently known as GlobalFoundries Singapore Pte Ltd) in 2001 and subsequently joined STATS ChipPAC Pte Ltd (currently a subsidiary of JCET Group Co.) as Deputy Director in 2011. His major interests are in Advanced Wafer-level Packaging and Wafer-level Integration Technology, including Fan-out/Fan-in WLP, Integrated Passive Device (IPD), Through-Si-Via (TSV), and 2.5D and 3D IC Packaging, as well as nanomaterials and additive manufacturing, thermal management, co-packaged optics, flexible electronics and sensors, failure analysis and reliability engineering, and Artificial Intelligent (AI), Machine Learning (ML) and Deep Learning (DL) system development. He is a Senior Member of IEEE and has published extensively with patents filed on these technologies.

Yeow Kheng is also actively involved in both local and international technical activities such as Chairman (2012-13), Vice Chairman (2019), Treasurer (2010-11, 2016-17 & 2022-23) and Committee Member (2009, 2014-2015, 2018, 2020-2021 & 2024-2025) of IEEE Singapore Reliability/ Electronics Packaging/ Electron Devices Joint Chapter; Committee Member (2014-25) of International Electrotechnical Commission Singapore National Working Group for Semiconductor Devices; Member (2021-25) of Singapore Future Microelectronics Heterogeneous Integration Task Force; Board Member (2015-25), General Chair (2014), Technical Chair (2012-13) and Technical Co-chair (2010-11), Technical Sub-committee Co-chair (2009-25) of International Symposium on Physics and Failure Analysis of Integrated Circuits; Technical Chair (2023-25) and Organising Committee Member (2021-22) of International Electronics Packaging Technology Conference; Treasurer (2015) of Conference on Electron Devices and Solid-State Circuits; Programme Committee Member Asia (2014-25) of International Interconnect Technology Conference Advanced Metallisation Conference; Technical Sub-committee Member (2009-25) of International Reliability Physics Symposium.