Design and Enhancement of Package Performance

Course Objectives

This one-day course covers the performance of microelectronics packaging, focusing on thermal, electrical, and package reliability aspects. Given the multidisciplinary nature of this field, many industry professionals may not have a comprehensive understanding of how various design and material choices impact package performance.

The course will begin with a recap of electrical and thermal performance in microelectronics packaging, providing participants with a solid foundation. It will then delve into key failure mechanisms, examining the factors that contribute to reliability challenges. By gaining deeper insights into these principles, attendees will be better equipped to identify and implement design and material solutions that enhance package performance and long-term reliability.

This workshop is essential for industry professionals involved in Semiconductor packaging, including directors, managers, process engineers, and R&D engineers. It is also highly beneficial for sales and application engineers who provide packaging materials and tools, equipping them with a deeper understanding of key challenges and performance factors in the field.

Scope 

1. Principles in thermal characterization and performance of package
2. Principles of electrical management ranging from skin effect, time delay to noises such as transmission lines, reflection and cross-talk
3. Reliability management inclusive of the various failure mechanisms ranging from thermomechanical, chemical, physical to electrical.
4. Failure analysis techniques to understand the mechanisms and enhance the package reliability.

Course Details

1. Thermal Management

               1.1 Introduction

               1.2 Thermal Management Fundamentals

               1.3 Thermal Management Method

2. Electrical Management 

               2.1 Introduction

               2.2 Electrical Phenomenon

                       - Skin effect, time delay, Time of flight, EMI

               2.3 Noises

                       - Transmission lines, Reflection, x-talk, switching noise

3. Reliability Management

               3.1 Reliability Tests

               3.2 Failure mechanism and DFR

               3.3 Thermo‐mechanical Mechanisms

                       -Thermo-mechanical Stresses, Fatigue

               3.4 Chemical Failure Mechanisms

                       - Corrosion, Intermetallic Diffusion

               3.5 Physical Failure Mechanisms

                       - Fracture, Creep, Moisture, Mechanical, Delamination, Plastic Deformation, Intermetallic

               3.6 Electrical Failure Mechanisms

                       - ESD, Electromigration, Whisker