Semiconductor Packaging and Trends

Day 0 | Monday, 4 May 2026 | 08:30 - 17:30 

Room @my12-13, Level 1A, MITEC

Semiconductor packaging plays a vital role in protecting chips, enabling electrical connections, and ensuring reliable performance across a wide range of electronic applications. This workshop offers a clear and practical introduction to the fundamentals of semiconductor packaging, making it ideal for professionals looking to build or strengthen their understanding of this essential part of the semiconductor value chain.

Participants will learn about conventional packaging types, materials, and processes, including wire bonding, lead frames, and basic assembly and testing methods. The course will also explain how packaging influences performance factors such as thermal management, reliability, and product lifespan.

In addition to core concepts, the workshop explores current industry trends and market dynamics affecting semiconductor packaging. Topics include supply chain considerations, cost drivers, sustainability concerns, and the growing demand from sectors such as consumer electronics, automotive, and industrial applications. Real-world examples will help participants connect foundational knowledge to practical business and operational decisions.

Whether you are in engineering, procurement, business development, or new to the semiconductor industry, this workshop will equip you with essential insights to better understand packaging processes and engage more effectively with suppliers and partners.

Who Should Attend

• Engineers and technical professionals
• Procurement and sourcing specialists
• Business development and sales professionals
• Individuals new to the semiconductor industry

What You’ll Gain

• A solid understanding of semiconductor packaging fundamentals
• Knowledge of conventional packaging processes and materials
• Insights into key industry trends and market drivers
• Practical awareness to support technical or business decisions