Mr. Daniel NG
Principal Member of Technical Staff, AMD
Daniel leads OSAT technology development at AMD's packaging division. His team has delivered various organic and inorganic interposer solutions that are used in AMD's product lines.
Presentation Title
Chiplet Architectures enabling next generation AI and HPC Applications
Abstract
Chiplet architectures are fundamental to the continued economic viable growth of power efficiency of AI, 5G and edge computing. The slowing of Moore's law has also placed advanced packaging at the critical juncture of technology-architecture intersection driving unique product capabilities. New heterogeneous architectures like 2.5D Fanout and 3D Hybrid bonded architectures driving AMD's industry leading advanced technology roadmap to enable power, performance, area, and cost (PPAC) will be discussed. Other topics including Chiplets for AI, challenges and solutions for large chiplet modules etc. will also be discussed. We will specifically focus on how advanced 3D packaging is enabling industry's best AI architectures.