Chiplet Technology and Heterogeneous Integration Summit

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Chiplet Technology and Heterogeneous Integration – The Road Ahead

Synopsis:

Heterogenous integration with multi-system chiplet module has been an enabler for system customization in high performance computing segment. Such packaging technologies offer advantages and flexibilities for managing yield and performance for SOC/HPC packages. With the ability to deliver higher performance, such packages also offer better power efficiencies and thus reducing costs for end use application.

This forum will focus on the use of heterogenous integration technology for chiplets based architecture, its future needs, and challenges.

Session Chair

Mr. Samuel GOH
Chairman of SEMI SEA Advanced Packaging
Senior Director, AP Product Marketing, Kulicke & Soffa Pte Ltd

Time	Program
10:00 - 10:05 hrs	Welcome Remarks by Session Chair
10:05 - 10:30 hrs	Keynote: Accelerating the AI economy through Heterogeneous Integration. Mr. Ingu Yin CHANG, Senior Vice President of Technology Marketing & Sales, ASE, United States
10:30 - 10:55 hrs	Chiplet Architectures enabling next Generation AI and HPC Applications Mr. Daniel NG, Principal Member of Technical Staff, AMD, Taiwan
10:55- 11:20 hrs	Enabling Systems of Chips for the AI-era Mr. Teng Chow OOI, Senior Director, Program Management Office, Penang Disaggregation Manufacturing (PGDM), Intel Electronics (Malaysia) Sdn. Bhd., Malaysia
11:20 - 11:35 hrs	Break & Networking
11:35 - 12:00 hrs	Enabling heterogenous integration interconnects with equipment technology solutions Mr. Lee Peng CHUA, Director of Technology, Sabre 3D Platform, WETS Metals Business Unit, Lam Research
12:00 - 12:25 hrs	Flash Memory Packaging - At the Crossroads? Dr. Rama SHUKLA, Vice President, Flash Components, Western Digital
12:25 - 12:50 hrs	Chiplet Market and Technology. Where we are? Mr. Vishal SAROHA, Technology and Market Analyst, Yole Group
12:50 - 12:55hrs	Token of Appreciation
12:55 - 13:55 hrs	Lunch & Networking
13:55 - 14:00 hrs	Afternoon Remarks by Session Chair
14:00 - 14:25 hrs	Fluxless TCB for Chiplet Integration Mr. Samuel GOH, Senior Director Advanced Packaging/ Product Marketing, Kulicke & Soffa Pte Ltd, Singapore
14:25 - 14:50 hrs	Addressing Key Challenges in Chiplet-Based Heterogeneous Integration Dr. Suresh Kumar SINGARAM, Head of Asian Technical Task Force, Evatec SEA Pte Ltd, Singapore
14:50 - 15:15 hrs	Accelerate Panel Level Packaging and Advanced IC Substrate Ramp with Versatile Process Control Solutions  Mr. Nathan PENG, Product Marketing Manager, Onto Innovation, Taiwan
15:15 - 15:30 hrs	Break & Networking
15:30- 15:55 hrs	Innovative Material Solutions in New Era of Heterogeneous Integration. Dr. Rose GUINO, Manager Application Engineering, Southeast Asia, Henkel
15:55 - 16:20 hrs	Charting the Course: Navigating Opportunities and Challenges in Advanced Packaging for Malaysia's OSAT Industry  Dr. Hing Wah LEE, Principal Researcher and Head of Semiconductor R&D, MIMOS Berhad, Malaysia
16:20 - 16:35 hrs	Lucky Draw & Closing Remarks by Session Chair

*Program and Timing are subjected to change.