Mr. Teng Chow OOI
Senior Director, Program Office, Intel Disaggregation Manufacturing Operations, Malaysia
Teng Chow joined Intel Disaggregation Manufacturing Operations in 2021 as the Senior Director of the Program Office. In his role, his is responsible for overlooking the start-up of the Advanced Packaging Factory from design review, hiring, supplier readiness, technology transfer to factory operations.
As an industry veteran, Teng Chow has more than 20 years of various experience including FPGA and ASIC IC design, lead Product Test Development engineering and lead automotive qualification for generations of FPGA products. Teng Chow holds a bachelor's degree on EE engineering from University of Technology Malaysia.
Presentation Title
Enabling Systems of Chips for the AI-era
Abstract
AI is dominating next wave of semiconductor growth from AI PC to hyperscalers. Heterogeneous integration and advanced packaging will be key to unleash the explosion of AI growth and the semiconductor industry. This presentation covers new heterogeneous architecture like 2.5D, 3D and 3.5D technology, as well as future development that will enable scalability of low-power optical I/O bandwidth for future high-performance compute systems and new architecture.