Mr. Vishal SAROHA

Based in Dresden (Germany), he focuses on developing technology and market products and custom consulting projects in the manufacturing and global supply chain domain.
 

Prior to Yole Group, Vishal worked at GlobalFoundries, Dresden, first as an Integration & Yield Engineer and then as Sr. Engineer - Integration Engineering, where he was the owner of device and SRAM targeting-related activities on their 22FDX technology. Previously, he also had experience at imec (Belgium), where he worked on issues related to 3DIC packaging and device reliability.

Vishal holds a master's in nanotechnology from Katholieke Universiteit Leuven (Belgium) and a bachelor's in physics from the University of Delhi (India).”

Presentation Title

Chiplet Market and Technology. Where we are?

Abstract

Chiplet and Heterogeneous Integration requires both a design and an advanced packaging ecosystem. It is a growing trend specially in the AI, HPC, networking segments, and with potential scaling to other applications. Standards for chiplets are still not clearly defined, companies pursuing chiplet are still managing the architectures internally through their own proprietary interconnection schemes. Heterogenous integration with SiP or 2.5D/3D solutions are depending on few companies offering the advanced packaging solutions. This presentation will give an overview of the market trends by different application and technology trends by few key players. Last, we will highlight few commercialized chiplet product and future product innovation direction.

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