SEMI Southeast Asia Technical Committees

Mr. Nelson WONG [Technical Committee Chairman]

Senior VP, Ball Bonder Business Unit
Kulicke & Soffa Pte Ltd

Group Manager, Research & Development
Carsem Technology Center, Malaysia

Director
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore

Head of Applied Packaging Development Center
Applied Materials, Inc.

Group VP – Head of Back End Manufacturing & Technology R&D
STMircoelectronics Pte. Ltd.

Senior Manager, Joint Lab Program
Institute of Microelectronics

Director/ Technology Development Centre & Technology Transfer Office
Institute of Technical Education

Managing Director
PECO Technologies Pte. Ltd.

Senior Manager, Technology Development
Unisem (M) Berhad

Senior Manager, Package Design, Assembly &Test Technology Development
Intel

Director
STATS ChipPAC Pte. Ltd.

AP R&D Director
ASE Malaysia

Business Development Director
Qdos Flexicircuits