Mr. Nathan PENG
Product Marketing Manager, Onto Innovation
Nathan is currently product marketing manager for inspection products at Onto Innovation. He has over 10 years experience working at various semiconductor equipment companies focusing on inspection and metrology as field applications engineer and technical product manager.
Presentation Title
Accelerate Panel Level Packaging and Advanced IC Substrate Ramp with Versatile Process Control Solutions
Abstract
Heterogeneous integration packaging technologies have seen increased adoption driven by the rapidly growing demand for advanced end applications like artificial intelligence (AI) and high-performance computing (HPC). To achieve optimal power, performance, area and cost for a specific application, integration at both wafer level and panel level have been adopted with continued research efforts to address the ever increasing I/O density, bandwidth and functionality demand. This talk will provide an overview on wafer and panel level heterogenous integration technology trends with specific focus on adv IC substrate – the foundation of all packages before connection to the PCB. We will discuss the manufacturing challenges in high density next-generation organic and glass core IC substrate as well as the importance of process control.