Dr. Yik Yee TAN
Senior Market and Technologies Analyst, Yole Group
Yik Yee Tan, PhD is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).
Presentation Title
Chiplet Market and Technology. Where we are?
Presentation
Chiplet and Heterogeneous Integration requires both a design and an advanced packaging ecosystem. It is a growing trend specially in the AI, HPC, networking segments, and with potential scaling to other applications. Standards for chiplets are still not clearly defined, companies pursuing chiplet are still managing the architectures internally through their own proprietary interconnection schemes. Heterogenous integration with SiP or 2.5D/3D solutions are depending on few companies offering the advanced packaging solutions. This presentation will give an overview of the market trends by different application and technology trends by few key players. Last, we will highlight few commercialized chiplet product and future product innovation direction.