Heterogeneous Integration and Failure Analysis: Enabling Next-Generation Electronics

Course Abstract

The semiconductor industry's transition from sole reliance on front-end node scaling to a combined front-end and back-end scaling approach has given rise to Heterogeneous Integration (HI), an innovative and ground breaking paradigm that integrates multiple chiplets fabricated with optimally chosen node technologies. By harnessing the strengths of diverse nodes, HI fuels technological and scientific advancements, complementing Moore's Law scaling. The successful implementation of HI relies on advanced packaging technologies, spanning device-level to system-level packaging, as well as effective Failure Analysis (FA) capabilities. Robust FA enables swift defect isolation, identification, and resolution, thereby accelerating time-to-market, enhancing yield, and boosting productivity. This comprehensive course provides a foundational understanding of HI and FA, covering essential techniques and methodologies for next-generation electronic systems

Course Objectives

Upon completing this course, participants will gain a deep understanding of Heterogeneous Integration (HI) and Failure Analysis (FA), empowering them to: 

• Master HI fundamentals: Understand concepts, benefits, and challenges
• Apply FA expertise: Familiarize with methodologies, techniques, and best practices
• Stay industry-current: Stay up to date with trends, advancements, and best practices in HI and FA

Course Outline

1. Heterogeneous Integration (HI) Fundamentals:
   • Categories, roadmaps, ecosystem, applications, and market trends
2. Material Integration Techniques:
   • Materials overview
   • Wafer bonding and stacking
   • Thinning and handling of thin wafers
   • Micro transfer printing and additive manufacturing
3. Device Integration Techniques:
   • Device integration strategies
   • Interconnect strategies
   • 2D, 2.5D, and 3D integration approaches
   • Wafer-level packaging
4. HI Requirements and Challenges:
   • HI requirements
   • Advanced packaging technologies
   • Substrate requirements
   • Board assembly and system-level integration
5. Test and Testability:
   • Test technology overview
   • Design for testability (DFT)
   • 2D and 3D-IC testing
6. Failure Analysis (FA) Advancement:
   • Fault isolation and physical FA workflow
   • 3D-IC FA challenges and solutions
   • Artificial Intelligence (AI) and Machine Learning (ML) applications in FA

Target Audience

• Engineers and researchers from the semiconductor, electronics, and materials science industries
• Academics and students interested in Heterogeneous Integration (HI) and Failure Analysis (FA)
• Professionals involved in product development, quality control, and FA