Yield Improvement, Defectivity Management and Root Cause Analysis (RCA) in Semiconductor Manufacturing
Day 0 | Monday, 4 May 2026 | 08:30 - 17:30
Room @my3-4, Level 1A, MITEC
Early Bird Rate (Till 15 April)
| Published Rate (16 April onwards)
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Achieving world-class yield is the heartbeat of every successful semiconductor fab. In this 1-day workshop, participants gain clear, practical insights into how defects impact production, how yield is modelled and improved, and how engineers uncover root causes to resolve issues quickly and effectively.
Designed for professionals across process, equipment, yield, and product engineering, this course blends foundational knowledge with real-world case studies and interactive activities to deliver immediately applicable skills.
What You’ll Learn
- The essentials of wafer fabrication and key yield-impacting parameters
- Modern defect inspection, monitoring, and mitigation strategies
- Yield and defectivity modelling used across global semiconductor fabs
- Line yield vs. die yield—and why both matter to cost and performance
- Product test flow, memory testing fundamentals, bitmap interpretation & FA techniques
- Practical troubleshooting flows for yield and defect issues
- Proven Root Cause Analysis methods supported by real fab examples
Why Attend?
Walk away with a sharper understanding of how to diagnose, interpret, and resolve yield excursions—boosting fab efficiency, product quality, and operational excellence.
Trainer
