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29 May 2024, Wednesday | 13:00 - 17:05 hrs |@my 9, Level 1A | Kuala Lumpur, Malaysia

SMART Mobility logo

Synopsis:

Powering Electrification

Automotive vehicles have transcended with increasing autonomous features and performance. Globally, automotive manufacturers are gearing up their innovations to achieve better designs, lower cost and more sustainable solutions to support the expansion of Electric Vehicles (EV) ecosystem as countries race towards Net Zero Emission by 2050.

The Smart Mobility forum with the theme of Powering Electrification, brings you the latest technologies and solutions in the EV segment. Join us to gain insights, network with the industry peers and forge new collaborations.

Program Outline

Session Chair

 

 Mr. Laith ALTIMIME 
 President, SEMI, Europe

 

 

TimeProgram
13:00 - 13:20 hrsWelcome Remarks by Session Chair
13:20 - 13:40 hrs

Opening Speech

Mr. Riduan RAHMAN, Director of Transportation Technology Division, Malaysian Investment Development Authority (MIDA)

13:40 - 14:10 hrs

 

 Automotive Semiconductor Trends

Mr. Changwook KIM, Managing Director and Partner, The Boston Consulting Group, South Korea

14:10 - 14:40 hrs

 

Powering our way with Semi-conductors  

Prof. Yvonne TAN, Vice President, Head of Tech Hub Singapore, Volvo Cars Singapore Pte Ltd

14:40 - 14:45 hrsBreak & Networking
14:45 - 15:15 hrs

 

ST Enabling Smart Electro Mobility

Mr. Chee Choong LEE, Technical & Products Marketing Manager, Automotive Product Group (APX), Asia Pacific Region excluding China (APEC) STMicroelectronics, Singapore

15:15 - 15:45 hrs

 

Empowering Smart Mobility: The Role of Compound Semiconductors

Dr. Jayakrishnan CHANDRAPPAN, Head of Technology - Advanced Packaging, CSA CATAPULT, United Kingdom

15:45 - 16:50 hrs

Panel Discussion

Moderator: Mr. Laith ALTIMIME, President, SEMI Europe

Panelists:

  Prof. Yvonne TAN, Vice President, Head of Tech Hub Singapore, Volvo Cars Singapore Pte Ltd, Singapore

  Mr. Chee Choong LEE, Technical & Products Marketing Manager, Automotive Product Group (APX), Asia Pacific Region excluding China (APEC) STMicroelectronics, Singapore

  Dr. Jayakrishnan CHANDRAPPAN, Head of Technology - Advanced Packaging, CSA CATAPULT, United Kingdom

16:50 - 17:05 hrsLucky Draw & Closing Remarks by Session Chair

Program and Timing are subjected to changes.