The Future of IC Substrates and Beyond Symposium 2025 | Day 3 | 22 May 2025, Thursday | 08:55 - 17:30hrs
The rapid advancement and widespread adoption of artificial intelligence (AI) have significantly accelerated innovation in the electronics industry, driving unprecedented demand for high-performance semiconductors. At the heart of this evolution, integrated circuit (IC) substrates have emerged as a critical enabler—enhancing power efficiency, enabling miniaturization, and pushing the boundaries of next-generation electronics.
Co-organized by the Hong Kong Printed Circuit Association (HKPCA) and the Korea Electronics Packaging and Circuits Association (KPCA), in conjunction with the SEMICON South East Asia 2025 in Singapore, the “Future of IC Substrates and Beyond Symposium 2025” will bring together industry leaders, researchers, and innovators to explore the cutting-edge technologies shaping this pivotal sector.
The symposium will feature expert discussions covering a wide range of topics, including the current landscape of substrate and interconnect technologies, co-design considerations for integrated packages, and the challenges posed by artificial intelligence. Attendees will gain insights into the advancements in SiC power semiconductors, advanced packaging substrates development, and the emerging trends driving high-performance semiconductor packages and Substrates Technology.
The symposium will conclude with an expert panel discussion, fostering dynamic dialogue on the future trajectory of IC substrates and their transformative impact on the global semiconductor ecosystem.
Join us at this premier industry event to discover the latest advancements, network with key stakeholders, and explore the challenges and opportunities defining the future of IC substrates.
Registration is open!
EARLY BIRD RATE | PUBLISHED RATE | STUDENT | ||
SEMI-Member | Non-Member | SEMI-Member | Non-Member | |
350 | 380 | 440 | 480 | NA |
- All prices listed are in Singapore Dollars and subject to 9% GST, applicable only to Singapore-based companies for pre-registration.
- For on-site registration (subject to seats availability), a 9% GST will be applied, regardless of the company's location.
- Ticket purchased are strictly non-refundable and non-transferable.
- Group discounts are not applicable for this symposium.
- This forum is not HRD Corp claimable (for Malaysia attendees).
Agenda
The Future of IC Substrates and Beyond Symposium 2025
22 May 2025 | 09:00 - 17:30hrs
| Time | Program |
|---|---|
| 08:45 – 08:55 hrs | Registration |
| 08:55 – 09:00 hrs | Welcome |
| 09:00 - 09:50 hrs | Keynote: The Overview of Substrate and Interconnect Technologies Dr. Kelvin PUN, GMI Research Institute Vice President, Goertek Microelectronics Inc |
| 09:50 - 10:40 hrs | Co-Design Considerations of Heterogeneous Integrated Package and Substrate Prof. Gu-Sung KIM, Electronic Packaging Research Center, Kangnam University |
| 10:40 - 10:55 hrs | Break & Networking |
| 10:55 - 11:45 hrs | Meeting AI Challenges-Large Package Solution and Warpage Management for Advance Substrates Mr. Allen CHEAH, Director of Applications / NSS, AT&S |
| 11:45 - 12:35 hrs | AI / HPC Advanced Substrate Technology Overview Mr. Youngseob SHIN, Amkor Technology |
| 12:35 - 14:05 hrs | Lunch Break |
| 14:05 - 14:55 hrs | SiC Power Semiconductors and Packaging Technology Mr. Ben KIM, Onsemi Korea |
| 14:55 - 15:45 hrs | Development and Characteristics of Advanced Packaging Substrate Dr. Rambo SUN, Chief Technology Officer, Bomin Electronics |
| 15:45 - 16:00 hrs | Break & Networking |
| 16:00 - 16:50 hrs | Substrates Technology and Trend for High Performance Semiconductor Packages Dr. Chiwon HWANG, Head of Semiconductor Package R&D, Samsung Electro-Mechanics |
| 16:50 - 17:30 hrs | Panel Discussion |
*Program subject to changes
Featured Speakers
Dr. Kelvin PUN - Keynote Speaker
Prof. Gu-Sung KIM
Mr. Allen CHEAH
Mr. Youngseob SHIN
Mr. Ben KIM
Dr. Rambo SUN
